Job Description
Teledyne Scientific & Imaging is a leader in providing enabling technologies for industrial growth markets. They are seeking a Hybridization Engineer to join their mission-focused team, where responsibilities include determining tooling and conditions for various processes and optimizing production designs. Responsibilities Determine tooling and conditions for various processes, including etching, flip-chip bonding, polishing, and AR coating Review components and assembly designs to optimize production Track key process controls and measurements needed to verify success and meet assembly specifications Skills Knowledge of flip-chip bonding and assembly processes, including epoxy bonding, polishing, substrate removal and AR coating Strong background in opto-electronic semiconductor devices or similar area of knowledge Experience in DOE, product and technology development Strong technical writing and communication skills are required to complete whitepapers, proposals, technical reports, and support customer reviews Computer proficiency using bolthires Office Suite (Word, Excel & PowerPoint) Bachelor's or Master's Degree with one (1) to three (3) years of experience; or equivalent combination of education and experience U.S.
Citizenship due to access restrictions Benefits Health, Dental, Vision, and Life Insurance from Day 1 Paid Vacation, Sick Time, and Holidays 401(k) with Company Match Employee Stock Purchase Plan Educational Tuition Reimbursement Fun Employee Events throughout the year Company Overview Teledyne Scientific & Imaging provides research and development services in the areas of electronics, imaging sensors. It is a sub-organization of Teledyne Technologies. It was founded in 1960, and is headquartered in Thousand Oaks, California, USA, with a workforce of 201-500 employees.
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